 |
ENCAPSULANTS |
| Advantages |
Viscosity
@
10 rpm (cps) |
Glass
Transition
DMA (C) |
CTE
(ppm/C) |
Pot
Life
@25C |
EN-7925
Thermally
Conductive
Low
CTE, High Tg |
High
thermal conductivity of 1.5W/mK. Provides great heat dissipation.
Premium, low stress chemistry. |
62,000 |
140 |
20 |
96
hrs. |
EN-7800
Premium
Globe Top
Low
Modulus |
Premium
resin blend offering the user a low stress encapsulant material. High
purity. Low alpha particles. |
75,000 |
140 |
23 |
96
hrs. |
EN-7700
Premium
Globe Top
Lowest
CTE |
Lowest
CTE system available for minimal stress during temperature cycling.
Low alpha particles. High purity. |
78,000 |
174 |
16 |
48
hrs. |
EN-7500-S
Premium
Silicone
Excellent
Tear Strength |
Tough,
soft glob top encapsulant. Excellent adhesion to passivation coatings,
metals and plastics. Low stress. |
28,000 |
-121 |
>300 |
3 months
|
EN-7400
Mid
Range Glob Top
Great
Property Balance |
Low
CTE, room temperature stable system offering consistent thixotropic
ratio, high purity and high gloss. |
65,000 |
>120 |
<30 |
3
months |
| 