 |
THERMAL
INTERFACE MATERIALS |
| Advantages |
Thermal
Conductivity (W/mK) |
Glass
Transition DMA (C) |
Pot
life @ 25C |
TM-6800
High
Thermal Conductivity
Great
Moisture Resistance |
Aluminum
nitride filler delivers maximum thermal conductivity. Developed for
die attach & high reliability thermal adhesive applications requiring
low stress and low moisture absorption. |
4.0 |
65 |
>48
hrs. |
TM-6650
Phase
Change
Lowest
Thermal Resistance |
Phase
change material supplied as a 4 mil film. Designed to minimize contact
resistance. Excels at low thicknesses. |
1.0 |
<0 |
Film |
TM-6600
High
Thermal Conductivity Film |
Aluminum
nitride system that delivers maximum thermal conductivity. Supplied
in B-staged form in custom sizes and thicknesses. |
5.0 |
145 |
Film |
TM-6520
Low
Modulus
Great
Adhesion |
Lower
modulus than the TM-6800 system. Outstanding adhesion on various substrates.
High purity system. |
4.5 |
<0 |
>48
hrs. |
TM-6510
Room
Temperature Stable
Low
Modulus |
Flexible,
silicone system offering maximum stress reduction for general heat
sink attach & fragile components. |
3.5 |
<0 |
3
months |
TM-6200
Room
Temperature Stable |
Room
temperature stable system for general heat sink attach. High purity,
fast curing. Great adhesion to various substrates. |
4.0 |
120 |
3
months |
| 